MAKECIRCUITStart a Project ↗
← Engineering Cases
CASE 04INDUSTRIAL EDGE HARDWARE

One hardware platform. Multiple product configurations.

A modular industrial gateway developed around a common processing platform, allowing the customer to adapt network configurations without redesigning the complete product.

APPLICATIONIndustrial automation and edge data
CORE REQUIREMENTLinux / Node-RED gateway with swappable Mini PCIe communication modules
DEVELOPMENT SCOPEPlatform architecture, thermal design and power integrity
STATUSMultiple product configurations from one core platform
01THE REQUIREMENT

A gateway platform that could
adapt to each deployment.

The customer needed a gateway to collect data from field meters, sensors and PLCs and make it available to higher-level systems. Node-RED was required on the device to support flexible field configuration and data flows.

The same core hardware also needed to support different network configurations through user-swappable Mini PCIe communication modules rather than separate mainboard designs.

02THE ENGINEERING CHALLENGE

Performance, thermals and modularity
inside a DIN-rail enclosure.

The processing and memory architecture had to support the application layer within a constrained industrial enclosure.

Thermal behavior, power integrity and interaction between optional communication modules also had to be considered within the same compact platform.

03THE ENGINEERING

A common core, designed for variation.

MODULAR PRODUCT ARCHITECTURE
COMMON COREProcessing + MemoryShared across product variants
↕MINI PCIE MODULE INTERFACE
Wired NetworkMini PCIe option
Local RadioMini PCIe option
Cellular ModuleMini PCIe option
DIN-RAIL PRODUCTOne platform, multiple configurations
DESIGN INTENT

Product variation was moved into replaceable modules while the processing platform remained common.

MODULAR ARCHITECTURE

A common Linux-capable processor and memory platform was separated from user-swappable communication hardware through a Mini PCIe module architecture.

THERMAL DESIGN

The processor thermal path was engineered around the constrained DIN-rail enclosure to move heat away from the processing hardware.

POWER INTEGRITY

The power architecture was designed for electrically noisy industrial panels, with filtering and isolation appropriate to the operating environment.

CONFIGURATION STRATEGY

Different network requirements could be addressed by changing Mini PCIe communication modules while retaining the same core processing platform.

04THE OUTCOME

One platform instead of
multiple mainboard designs.

The modular architecture allowed the customer to create different gateway configurations around the same core hardware.

The Linux-capable core supported Node-RED at the application layer, while user-swappable Mini PCIe communication modules reduced the need to develop and maintain independent mainboards for each network configuration.

Have a product with a similar constraint?

Start a Project ↗